Nvidia’s next-gen Vera Rubin platform is hitting technical friction; GPU compute tray designs remain unfinalized, posing a risk of partial shipment delays as mass production kicks off in Q3 2026. 1
Nvidia’s shift toward TSMC’s COUPE (CPO) advanced packaging marks the commercial realization of Silicon Photonics. Expect a CoWoS-style adoption curve with mass production locked for 2026. 2
SK Hynix is currently redesigning its 11.7Gbps HBM4 stack. High probability that only second-tier products will supply this year, with top-tier re-entry pushed to 2027. 3
SMIC is losing pricing power on 8-inch wafers. Price hikes are facing severe headwinds, driving volume toward Korean foundries. 4
DeepSeek’s efficiency “breakthrough” is likely an illusion created by drastically lower human labor costs rather than superior algorithmic architecture. 5
Anthropic has effectively become the “RealOpenAI.” By open-sourcing Claude Code, they have demonstrated a commitment to open collaboration that OpenAI has long abandoned. 8
The sudden 2-to-3 week Iran exit timeline is the start of a “Victory Narrative.” It’s a strategic maneuver to declare a successful conclusion and pull out regardless of the ground reality. 9