📌 SK Hynix Switches to Intel Packaging, Advanced Packaging Bottleneck Reshapes Competitive Landscape
SK Hynix confirmed that its next-generation HBM will adopt Intel’s EMIB advanced packaging technology. This decision directly stems from the ongoing shortage of TSMC’s CoWoS capacity, indicating that the supply bottleneck in advanced packaging is creating alternative demand for Intel. For Intel, this means a new source of orders, potentially changing its competitive position in the advanced packaging market.
Meanwhile, KYEC, Nvidia’s major chip testing partner, is expected to be busy until the end of the year, with its Rubin GPU delayed to the end of the third quarter due to thermal design adjustments, with mass shipments concentrated in the fourth quarter. This shows that Nvidia’s demand remains strong, but it also intensifies supply pressure in advanced packaging and testing.
Advanced packaging is a critical step for high-performance chips like HBM and GPUs, and capacity constraints directly impact chip delivery and costs. SK Hynix’s choice is both a response to TSMC’s capacity bottleneck and may prompt more customers to consider Intel’s packaging solutions. In the future, attention should be paid to TSMC’s CoWoS expansion progress and Intel’s EMIB yield and capacity ramp-up, as these will determine whether this alternative demand can be sustained.
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