📌 X Insight Update[x_fin] (2026/07/01 05:14)
- $TSM has a deeper moat setup into 2029. The edge is shifting from transistor density to packaging capacity. Panel-level CoPoS could pack more compute dies and up to 12 HBM4 stacks into one package, strengthening TSMC behind next-gen $NVDA and $AMD chips. [1](https://x.
📌 X Insight Update[x_fin] (2026/05/19 23:08)
- Equities and bond yields being simultaneously “sky high” looks unstable. Add stubbornly high oil, and the market is stuck in a three-way squeeze where something likely has to give soon. 4